Congratulations to Dr. Xinhang Jin for the new paper in Composites Part B: Engineering!
Dr. Xinhang Jin successfully developed and published on multiscale hexagonal boron nitride (h-BN) incorporated into a cellulose nanofiber (CNF) matrix as thermally conductive substrates with a balanced combination of mechanical and thermal properties.
Sustainable, flexible, tough, and thermally conductive substrates are critically required for next-generation green electronics. The CNF/multiscale h-BN nanopaper exhibits mechanical strength and flexibility comparable to commercially used substrates such as PI and PET, while achieving thermal conductivity approximately 10 times higher than that of PET and 5 times higher than that of PI.
Read more here: Composites Part B: Engineering, 2026, 324, 113888, https://doi.org/10.1016/j.compositesb.2026.113888